Mechanical seal manufacturer Common sense of purchasing various seals

One component product modified by epoxy

1. The density varies from 1.1 to 2.8, and the curing time is 50 degrees/4 hours or 110 degrees/30 minutes or 110 degrees/50 minutes;

2. It has moderate thixotropy. It can cover and wrap electronic components when draped on the circuit board. The glue can level itself without flowing, and it will not flow during baking and curing, keeping its original shape;

3 The cured product is black or amber bright, which has strong adhesion to the circuit board and electronic components, and can withstand the alkali corrosion of the mechanical seal used for 200-300 ℃ high temperature and strong acid desulfurization pump and various solvents;

4 High adhesive strength, good heat resistance and excellent solvent resistance. The adhesive strength can achieve device damage and temperature resistance can also achieve device damage. The cured product is not corroded by professional solvents, which can help protect circuits and electronic components and prevent internal technical leakage of devices;

5. This product is applicable to the confidential potting of electronic devices. After curing, it has a strong solvent resistance of stirring mechanical seal, and can withstand the long-term immersion of organic solvents; With extremely high thermal deformation temperature, it can resist high temperature damage; At the same time, it has good hardness and wear resistance, and can resist the erosion damage of general cutting tools.

6 Use this product to encapsulate electronic circuits with excellent anti decryption performance.

7. This product is easy to use, long storage period, high bonding strength, fast curing speed, low shrinkage, non-toxic and harmless.

8 Store at room temperature for 70 days and in refrigerator for more than half a year.

Two epoxy modified two-component product is a two-component heat curing potting material. After curing, it becomes a dense solid structure with high hardness, good heat resistance, extremely difficult to disassemble, and can play the role of protection, waterproof, and confidentiality.

1. Product features: 1) Good bonding strength and stable performance. 2) Low viscosity, good fluidity, no bubbles, good toughness. 3) Good processability, can be cured at room temperature or at elevated temperature, and has fast curing speed and convenient operation.

2. Usage: The product is divided into two components, A and B, and the ratio of A: B is 100:40. When using, it is necessary to accurately weigh A and B, fully mix them into a uniform mixture, and pour them according to the curing conditions.

3. Curing condition: 120 ° C/2 hours or 80 ° C/4-5 hours

4. Performance after curing: 1) Hardness:>802) Volume resistance: 2.6 × 1015 Ω - cm3) surface resistance: 3.7 × 1013 Ω 4) Breakdown voltage: 25kv 5) Dielectric constant: 3.5 @ 1KHz6) Dielectric loss: 0.027) Impact strength:>9.5kg/cm8) Bending strength:>900kg/cm

5 Transportation and storage: 1) Both components A and B shall be sealed and stored in a dry and cool place; 2) The storage period is one year; 3) This product is not dangerous and can be stored and transported as general chemicals.

In a word, our insulating resin is specially used for the protection of electronic circuit modules. The cured product has a high-density solid structure, high adhesion with PCB boards and electronic components, and good temperature resistance and solvent resistance. It can ensure that the electronic circuit will not be disassembled from three aspects of adhesion, temperature resistance and solvent resistance. It is an ideal choice for the protection of PCB electronic circuit modules.